Teradyne has introduced Iris 100, a production-ready optical test platform for microLED devices, as manufacturers move the technology from laboratory development toward volume production. The platform is designed to test individual emitters across arrays containing millions of microLEDs, with applications spanning AR displays and optical interconnects being developed for AI data centers. The race to…
Lumentum, Qualcomm Technologies and Corning are demonstrating a high-density optical die-to-die interconnect architecture designed for next-generation AI scale-up systems. The ECOC 2026 showcase combines Qualcomm’s D2D interface technology with Lumentum’s 1060nm VCSEL optical engine and Corning’s multimode fiber connectivity, targeting bandwidth-dense links that extend beyond the practical reach of electrical interconnects. AI accelerators are becoming…
Marvell Technology is demonstrating a new generation of 2nm optical interconnect technologies designed to help AI data centers move from 1.6T toward 3.2T networking. At ECOC 2026, the semiconductor company is showcasing 400G-per-lane PAM4, 800G ZR/ZR+ with integrated MACsec, 1.6T coherent links and a 102.4Tbps co-packaged optics platform. The race to scale AI infrastructure is…
Semtech has joined the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA), adding its 200G-per-lane modulator drivers and transimpedance amplifiers to an industry effort focused on higher-density optical interconnects for AI data centers. The move comes as AI clusters push networking toward higher bandwidth, tighter power budgets and denser optical designs. The next bottleneck in AI…
Semtech is moving its 50G optical fronthaul portfolio into full production as mobile operators prepare 5G-Advanced networks for a more AI-intensive traffic mix. The semiconductor company’s CDR and transimpedance amplifier technologies are designed for 50G optical interfaces supporting next-generation radio deployments and higher uplink demand from generative AI, multimodal applications and connected devices. The rise…
Keysight Technologies is using ECOC 2026 to showcase testing, simulation and validation technologies aimed at one of the biggest challenges in AI infrastructure: moving increasingly large volumes of data between accelerators, servers and storage. The demonstrations span photonic integrated circuits, AI networking, 1.6T optical links, 3.2T research and AI-enabled test automation. As AI clusters grow,…
Faraday Future has unveiled nine new embodied AI devices and four industry productivity solutions as it expands beyond electric vehicles into robotics. The company’s latest lineup spans humanoid and quadruped systems, with prices ranging from $9,990 to $137,900, alongside software, skills and industry-specific services. Faraday Future is attempting to turn its move into embodied AI…
Quectel Wireless Solutions has introduced the SE200ZC-AP, a compact smart module designed to bring on-device AI, computer vision and connectivity to cameras, industrial systems, vehicles and other IoT devices without requiring manufacturers to develop custom computing hardware. AI-enabled cameras and connected devices are increasingly moving inference closer to where data is generated, creating demand for…
Huawei has upgraded its Stellar AI WAN Solution to address the networking, cost and security challenges of running AI workloads across geographically distributed infrastructure. Announced at HUAWEI CONNECT 2026, the solution combines lossless networking, distributed inference techniques and multi-layer security to make remote computing resources more accessible to enterprises. As AI workloads spread across regions,…
