(KRX: 248070) is expanding its collaboration with Infineon Technologies to develop high-voltage direct current (HVDC) power solutions for next-generation AI data centers. Under a new memorandum of understanding, the companies will work across intermediate bus converters, battery backup units, and power supply units, combining Infineon’s silicon, silicon carbide, and gallium nitride semiconductor technologies with SOLUM’s server power design and manufacturing capabilities. A key development is a 26 kW-class battery backup converter for 800 Vdc rack architectures, targeting peak efficiency above 98.5%, with mass production planned for 2027.
SOLUM and Infineon Target AI Data Center Power Bottlenecks
AI infrastructure expansion is putting pressure on a part of the data center that receives less attention than GPUs and networking: power delivery. As accelerator deployments increase rack-level electricity requirements, operators need power systems that can deliver more energy with fewer conversion losses, while maintaining stable operation during electrical disturbances.
The SOLUM-Infineon agreement targets that challenge through three components of the data center power chain: intermediate bus converters (IBCs), battery backup units (BBUs), and power supply units (PSUs).
800 Vdc Architectures Change How AI Racks Receive Power
Traditional data center power systems typically convert electricity through multiple stages before it reaches server components. Each conversion introduces some energy loss, and the complexity of the distribution path increases as rack power requirements rise.
High-voltage direct current architectures are attracting attention because they can reduce current for a given power level, simplify distribution, and potentially reduce the number of conversion stages. NVIDIA’s 800 Vdc architecture, developed with participation from companies across the power ecosystem, is designed to support higher-density AI infrastructure and future generations of AI servers.
SOLUM and Infineon are expanding their work to address the conversion and backup requirements within this evolving architecture.
Under the memorandum of understanding, Infineon will provide early-stage technology consultation, reference designs, and technical support. Its portfolio includes silicon, silicon carbide (SiC), and gallium nitride (GaN) power semiconductors, along with control technologies.
SOLUM will contribute server power engineering and manufacturing capabilities, developing power products and pursuing opportunities with international customers.
The arrangement is intended to bring semiconductor expertise and power-system design together earlier in product development, rather than treating component selection and system integration as separate stages.
26 kW Battery Backup Converter Targets 800 Vdc Racks
A central product demonstrated at the companies’ Collaboration Tech Day in Yongin, South Korea, was a 26 kW-class BBU DC/DC converter designed for 800 Vdc rack power architectures.
The module is intended to help maintain AI server operation during momentary power interruptions. It incorporates Infineon CoolSiC MOSFETs, EiceDRIVER gate drivers, and PSOC digital power controllers.
SOLUM is targeting peak efficiency above 98.5%, with mass production planned for 2027. This remains a development target, rather than a confirmed production performance figure.
The use of SiC power devices is relevant to high-power conversion because these semiconductors can support efficient switching at high voltage and power levels. Gate drivers and digital controllers help manage switching behavior, protection, and power regulation within the converter.
SOLUM also presented an LVDC BBU DC/DC converter, an Open Rack v3 (ORv3)-compatible 33 kW power shelf, and server power supply units.
Together, these products cover different points in the power infrastructure stack. IBCs convert intermediate distribution voltages for downstream server components, PSUs supply regulated power to computing equipment, and BBUs provide backup energy during interruptions.
Semiconductor Choices Become More Important at Higher Power Density
The partnership brings together three semiconductor technologies with different characteristics.
- Silicon: A mature technology widely used in power conversion and control systems.
- Silicon carbide: Suitable for high-voltage and high-efficiency power applications, including demanding switching environments.
- Gallium nitride: Offers high switching-speed capabilities and can support compact, efficient power conversion designs.
The choice of device depends on voltage, switching frequency, thermal constraints, efficiency targets, and system cost. Combining these technologies across different stages of a power architecture gives designers more flexibility than relying on a single semiconductor type.
Infineon’s contribution includes its CoolSiC and other power semiconductor families, gate drivers, and digital control components. SOLUM’s role is to integrate these technologies into server power products that meet the requirements of AI data center operators.
AI Electricity Demand Is Increasing the Pressure on Power Infrastructure
The commercial opportunity is tied to the rapid growth of data center electricity consumption. The International Energy Agency’s updated outlook projects that global data center electricity use will rise from approximately 485 terawatt-hours in 2025 to 950 TWh in 2030. It also estimates that electricity consumption by AI-focused data centers will triple over the same period.
That growth makes power conversion efficiency more consequential. Even small improvements in a high-capacity facility can translate into meaningful reductions in electricity lost during distribution and conversion.
Reliability is equally important. AI workloads can involve large and rapidly changing power demands, making backup systems and power management essential to maintaining service continuity.
The IEA has highlighted the increasing power density of AI servers and the importance of energy storage in managing fluctuating demand.
Partnership Extends SOLUM’s AI Infrastructure Ambitions
For SOLUM, the agreement expands its power electronics business into a market shaped by hyperscale AI data center investment. The company has already announced development of an 800 Vdc, 26 kW converter, with production targeted for 2027. The Infineon collaboration adds semiconductor design support and a broader development relationship to that effort. SOLUM
For Infineon, the partnership provides another route to integrate its power semiconductor portfolio into rack-level AI infrastructure.
The companies are also targeting global customer opportunities, including North America, where demand for AI data center capacity is driving investment in power distribution, backup systems, and high-density server infrastructure.
The MoU does not establish a confirmed volume production contract or customer deployment. Its commercial significance will depend on whether the products meet efficiency, reliability, thermal, and cost requirements during development and qualification.
As AI data centers scale, the power infrastructure supporting GPUs is becoming a strategic part of the computing supply chain. SOLUM and Infineon are positioning their collaboration around that shift, with 800 Vdc conversion and backup technologies as key development priorities.
Market Landscape
AI data center power infrastructure is evolving around higher distribution voltages, improved conversion efficiency, and greater rack-level power density.
Three developments are shaping the market:
- 800 Vdc power distribution: Higher-voltage DC architectures can reduce current, conductor requirements, and conversion complexity in high-density AI facilities.
- Advanced power semiconductors: SiC and GaN technologies are becoming important for efficient power conversion at higher operating voltages and switching frequencies.
- Rack-level backup and power management: BBUs, power shelves, and digital controllers help maintain stable operations as AI workloads create demanding power conditions.
| Company | Relevant market positioning |
|---|---|
| Infineon | SiC, GaN, silicon power devices, gate drivers, and digital controllers |
| SOLUM | Server power systems, converters, BBUs, and power shelves |
| NVIDIA | 800 Vdc AI data center power architecture |
| Delta Electronics | Data center power systems and power conversion |
| Vertiv | Data center power management, UPS, and thermal infrastructure |
SOLUM and Infineon’s positioning is focused on the power conversion and semiconductor components required within next-generation AI server infrastructure. Their collaboration complements the broader ecosystem developing around 800 Vdc data center architectures.
Top Insights
- SOLUM and Infineon are expanding cooperation across intermediate bus converters, battery backup units, and power supply units for AI data centers.
- Their 26 kW-class BBU converter targets 800 Vdc rack architectures and peak efficiency above 98.5%, with production planned for 2027.
- Infineon contributes silicon, SiC, and GaN semiconductors, gate drivers, reference designs, and digital power control technologies.
- SOLUM will apply its server power engineering and manufacturing capabilities to develop products for international AI infrastructure customers.
- Rising data center electricity consumption is increasing demand for efficient power conversion, high-density distribution, and reliable backup systems.
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