Rebellions and CoAsia SEMI Partner on Advanced AI Chiplet Packaging for Data Centers
Korean AI semiconductor unicorn Rebellions is doubling down on chiplet architecture in a strategic pact with CoAsia SEMI, the system semiconductor design specialist behind some of the industry’s most advanced packaging tech. The two companies are teaming up to develop REBEL-based chiplet and software solutions aimed squarely at the data center and high-performance computing (HPC) sectors.
