VIA NEXT, a leading provider of system-level design services, has joined the Arm® Total Design ecosystem, signaling a commitment to accelerate AI and high-performance computing (HPC) innovation. The collaboration leverages VIA NEXT’s expertise in system integration, chiplet architectures, and advanced packaging to deliver end-to-end solutions from SoC architecture to system-level testing.
Expertise in System-Level and Chiplet Design
VIA NEXT offers a full spectrum of services, including engineering validation board (EVB) development, chip probe (CP) testing, and system-level testing (SLT). Its proven experience with heterogeneous integration and the Arm Chiplet System Architecture (CSA) allows VIA NEXT to deliver modular, scalable, and high-performance solutions tailored to AI, edge computing, data centers, and supercomputing applications.
“By joining the Arm Total Design ecosystem, VIA NEXT is well-positioned to accelerate the deployment of advanced AI and HPC solutions through chiplet-based architectures and next-generation system integration,” said Brian Wang, President of VIA NEXT.
Driving Next-Gen AI and HPC
Through advanced packaging and chiplet methodologies, VIA NEXT helps partners bring purpose-built silicon solutions to market faster, optimizing performance, scalability, and time-to-deployment. The company’s track record with global semiconductor partners underscores its ability to deliver complex, high-value designs across diverse application domains.
“Arm Total Design helps remove barriers to purpose-built silicon, giving partners the foundation and ecosystem they need to bring solutions to market faster,” said Eddie Ramirez, VP of go-to-market, Infrastructure Business, Arm. “With proven expertise in advanced packaging and complex chip integration, VIA NEXT will help mutual partners scale new Arm-based SoCs for AI and HPC applications and unlock more opportunities for innovation.”
VIA NEXT’s inclusion in the Arm ecosystem positions the company as a strategic enabler for next-generation AI and HPC solutions, combining chiplet-based architectures, modular design, and system-level integration to drive innovation and performance for semiconductor customers worldwide.
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