STMicroelectronics, a global leader in semiconductors, has introduced its next-generation silicon photonics and BiCMOS technologies designed to enhance optical interconnects in AI clusters and data centers. With AI computing demands rising, ST is addressing critical performance and energy efficiency challenges by delivering 800 Gbps and 1.6 Tbps optical modules, scheduled for production in the second half of 2025.
Advancing Optical Interconnects for AI
Modern data centers rely on thousands of optical transceivers to facilitate high-speed communication between GPUs, switches, and storage. ST’s new SiPho technology enables the integration of multiple complex components on a single chip, while its next-generation BiCMOS technology ensures ultra-fast, low-power optical connectivity—critical for AI-driven workloads.
“The demand for AI is accelerating high-speed communications in data centers. This is the right time for ST to introduce an energy-efficient silicon photonics technology, complemented by next-gen BiCMOS, to support the evolution of 800 Gbps – 1.6 Tbps optical interconnects,” said Rémi El-Ouazzane, President, MDRF Group, STMicroelectronics.
These technologies will be manufactured on 300mm processes in Europe, offering customers a reliable, high-volume supply chain for optical module development.
Industry Leaders on Board
Amazon Web Services (AWS) is collaborating with ST to develop PIC100, an advanced SiPho technology for AI workloads.
“AWS is working with STMicroelectronics because of its proven track record in silicon photonics, and we are excited about the innovations this will unlock,” said Nafea Bshara, VP & Distinguished Engineer, AWS.
Market Growth and Future Prospects
The data center pluggable optics market, valued at $7 billion in 2024, is expected to grow at a 23% CAGR, exceeding $24 billion by 2030, according to LightCounting. The market share of silicon photonic modulators is projected to increase from 30% in 2024 to 60% by 2030.
ST’s latest advancements position the company as a key supplier in the data center and AI cluster market, driving the next era of high-speed, energy-efficient optical interconnects.
