Lintes Technology (TWSE: 6715), a specialist in high‑bandwidth connectivity, announced a new modular interconnect solution aimed at next‑generation AI servers. The offering combines Near‑Packaged Copper (NPC) and Near‑Packaged Optics (NPO) into a single, patented socket architecture, allowing data‑center operators to select between electrical and optical links on a per‑socket basis.
The design departs from traditional fixed‑interface boards by giving administrators the ability to configure channel count and bandwidth allocation dynamically. Each socket can handle up to 6.4 Tbps, which can be split into either four 1.6 Tbps lanes or eight 800 Gbps lanes, providing the granularity needed for AI workloads that can demand aggregate bandwidth in the 100‑terabit range.
Bridging the Co‑Packaged Optics Gap
Industry observers have noted that Co‑Packaged Optics (CPO) remains a long‑term goal but is hampered by low optical‑engine yields, complex ASIC integration, and cost pressures that could postpone widespread adoption. Lintes’ near‑packaged approach, already validated in design labs and in early customer samples, offers a more immediate path for high‑density AI servers while the ecosystem continues to mature toward CPO.
Flexible Deployment Scenarios
The socket’s dual‑mode capability supports two primary use cases:
- Intra‑server and intra‑rack (scale‑up): NPC links connect AI accelerators or PCIe endpoints within a chassis, using familiar copper cabling options such as DAC, AEC, AOC, or ACC. This leverages copper’s lower cost and established deployment practices for short‑reach, high‑speed connections.
- Cross‑rack, long‑distance (scale‑out): NPO links pair with high‑density multi‑fiber connectors—including MPO, MTP, and MMC—to extend bandwidth across racks or even data‑center pods, satisfying the need for optical transmission over longer distances.
By keeping the physical interface unchanged, Lintes allows enterprises to upgrade bandwidth or switch transmission media without redesigning server boards or rewiring existing cable plants.
Capital Investment Targets 2027 Production
On June 11 2026, Lintes’ board approved an annual capex budget of roughly US$84 million (NT$2.65 billion). The funds will be directed toward clean‑room upgrades at a new fabrication site and the acquisition of multi‑channel optical module equipment, expanding the company’s capacity for both multi‑mode and single‑mode production.
The company expects to align the sampling phase with customer rollout plans and reach full‑scale volume production by 2027, positioning the technology as a bridge between today’s copper‑centric designs and the future optical‑heavy AI infrastructure.
Why It Matters for Enterprises
Enterprises deploying large language models or other generative AI workloads are increasingly constrained by the “data‑movement wall.” Lintes’ modular socket reduces that friction by letting operators fine‑tune bandwidth on a per‑socket basis, potentially lowering total cost of ownership while preserving the flexibility to adapt as AI model sizes evolve. The ability to mix copper and optics without a hardware redesign also simplifies procurement and inventory management, a tangible advantage for data‑center operators juggling rapid AI adoption cycles.
capital investment is aimed at scaling production capabilities for both copper and optical modules.
strategy considerations highlight the importance of adaptable interconnect solutions in modern data‑center architectures. Power Tomorrow’s Intelligence — Build It with TechEdgeAI
