Semtech Targets Dense Optics for AI Networks

Semtech Joins XPO MSA for Dense AI Optical Links

Semtech has joined the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA), adding its 200G-per-lane modulator drivers and transimpedance amplifiers to an industry effort focused on higher-density optical interconnects for AI data centers. The move comes as AI clusters push networking toward higher bandwidth, tighter power budgets and denser optical designs. The next bottleneck in AI…

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Semtech Brings 50G Fronthaul to 5G-Advanced

Semtech Brings 50G Fronthaul Silicon to 5G-Advanced

Semtech is moving its 50G optical fronthaul portfolio into full production as mobile operators prepare 5G-Advanced networks for a more AI-intensive traffic mix. The semiconductor company’s CDR and transimpedance amplifier technologies are designed for 50G optical interfaces supporting next-generation radio deployments and higher uplink demand from generative AI, multimodal applications and connected devices. The rise…

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Keysight Advances AI Optical Infrastructure

Keysight Targets AI Optical Infrastructure at ECOC 2026

Keysight Technologies is using ECOC 2026 to showcase testing, simulation and validation technologies aimed at one of the biggest challenges in AI infrastructure: moving increasingly large volumes of data between accelerators, servers and storage. The demonstrations span photonic integrated circuits, AI networking, 1.6T optical links, 3.2T research and AI-enabled test automation. As AI clusters grow,…

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Faraday Future Expands Embodied AI Robotics

Faraday Future Expands Embodied AI Robot Lineup

Faraday Future has unveiled nine new embodied AI devices and four industry productivity solutions as it expands beyond electric vehicles into robotics. The company’s latest lineup spans humanoid and quadruped systems, with prices ranging from $9,990 to $137,900, alongside software, skills and industry-specific services. Faraday Future is attempting to turn its move into embodied AI…

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Quectel Launches 3-TOPS Edge AI Smart Module

Quectel Launches 3-TOPS Module for Edge AI Cameras

Quectel Wireless Solutions has introduced the SE200ZC-AP, a compact smart module designed to bring on-device AI, computer vision and connectivity to cameras, industrial systems, vehicles and other IoT devices without requiring manufacturers to develop custom computing hardware. AI-enabled cameras and connected devices are increasingly moving inference closer to where data is generated, creating demand for…

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Tencent Cloud and UTM Expand AI Skills Partnership

Tencent Cloud and UTM Expand AI Skills Partnership

Tencent Cloud and Universiti Teknologi Malaysia (UTM) have formalized a three-year collaboration focused on AI education, cloud skills and industry-led problem solving. The partnership follows a five-week AI hackathon in which UTM students used Tencent’s AI tools to develop solutions for challenges supplied by Malaysian companies. The push to build AI talent is moving beyond…

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Huawei Upgrades Stellar AI WAN for AI Compute

Huawei Upgrades Stellar AI WAN for Remote AI Compute

Huawei has upgraded its Stellar AI WAN Solution to address the networking, cost and security challenges of running AI workloads across geographically distributed infrastructure. Announced at HUAWEI CONNECT 2026, the solution combines lossless networking, distributed inference techniques and multi-layer security to make remote computing resources more accessible to enterprises. As AI workloads spread across regions,…

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askelie Launches Operational AI Platform

askelie Launches Operational AI Platform for Business

askelie has launched an Operational AI Platform designed to let MSPs, software vendors and business users configure reusable AI capabilities for business workflows without building an AI foundation from scratch. Available from September 21, 2026, the platform combines AI, enterprise data, knowledge, workflows, integrations, security and governance around an Understand, Decide, Act, Control architecture. The…

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Huawei Upgrades Stellar AI Fabric for Agentic AI

Huawei Upgrades Stellar AI Fabric for Agentic AI

Huawei has upgraded its Stellar AI Fabric networking platform to support high-density AI clusters, targeting the throughput, reliability and utilization requirements of production-scale agentic AI workloads. The company unveiled the updated architecture at HUAWEI CONNECT 2026 alongside new data-center switches designed for high-performance computing environments. AI infrastructure is increasingly becoming a networking problem as much…

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