MediaTek is expanding beyond mobile processors with the Dimensity CX C10 Max, its first system-on-chip for the new Dimensity Compute Experiences family. Built on a 3nm process and designed for premium Googlebook devices, the chip combines an eight-core CPU, 11-core GPU and 55-TOPS NPU to put on-device generative and agentic AI at the center of…
TruVideo is integrating its automotive video communication platform with Meta’s AI glasses, giving dealership service technicians a hands-free way to start and stop recordings using voice commands. The integration connects wearable video capture with existing dealership management system (DMS) workflows, positioning AI glasses as a practical interface for automotive service documentation rather than simply another…
Tallinn, Estonia, 17 September 2026 – Cybersecurity company CybExer is leading a ten-company European consortium developing an end-to-end capability to test and validate protected satellite communications linked to IRIS², the EU’s future secure satellite connectivity system. Europe needs to know how secure satellite communications will perform under interference, disruption, and cyberattack before governments and critical…
1. SMEs, MNCs, government — who is moving fastest on meaningful deployment? Everyone is adopting AI. Buying copilots, running pilots, that is the easy part. Deploying is different. I mean a model running in production, with someone on your side who owns it. That is rarer, and it is the only measure I care about….
Walrus Pump is expanding its data-center liquid-cooling portfolio as rising AI compute density pushes thermal management closer to the center of infrastructure design. The Taiwan-based pump specialist will showcase TPMS, CMP and TPHK-S pump platforms at TAIWAN EXPO USA 2026, targeting in-row and in-rack coolant distribution units (CDUs) and immersion cooling systems. As AI accelerators…
ABB has launched Infinitus, a direct-current power portfolio designed for the rising electrical demands of AI data centers. The source-to-rack architecture brings together medium-voltage power, DC conversion, distribution, protection and cooling, with 800V DC architectures positioned as a way to reduce conversion losses and infrastructure footprint as AI rack power moves toward the megawatt range….
Teradyne has introduced Iris 100, a production-ready optical test platform for microLED devices, as manufacturers move the technology from laboratory development toward volume production. The platform is designed to test individual emitters across arrays containing millions of microLEDs, with applications spanning AR displays and optical interconnects being developed for AI data centers. The race to…
Lumentum, Qualcomm Technologies and Corning are demonstrating a high-density optical die-to-die interconnect architecture designed for next-generation AI scale-up systems. The ECOC 2026 showcase combines Qualcomm’s D2D interface technology with Lumentum’s 1060nm VCSEL optical engine and Corning’s multimode fiber connectivity, targeting bandwidth-dense links that extend beyond the practical reach of electrical interconnects. AI accelerators are becoming…
Marvell Technology is demonstrating a new generation of 2nm optical interconnect technologies designed to help AI data centers move from 1.6T toward 3.2T networking. At ECOC 2026, the semiconductor company is showcasing 400G-per-lane PAM4, 800G ZR/ZR+ with integrated MACsec, 1.6T coherent links and a 102.4Tbps co-packaged optics platform. The race to scale AI infrastructure is…
