1. SMEs, MNCs, government — who is moving fastest on meaningful deployment? Everyone is adopting AI. Buying copilots, running pilots, that is the easy part. Deploying is different. I mean a model running in production, with someone on your side who owns it. That is rarer, and it is the only measure I care about….
Walrus Pump is expanding its data-center liquid-cooling portfolio as rising AI compute density pushes thermal management closer to the center of infrastructure design. The Taiwan-based pump specialist will showcase TPMS, CMP and TPHK-S pump platforms at TAIWAN EXPO USA 2026, targeting in-row and in-rack coolant distribution units (CDUs) and immersion cooling systems. As AI accelerators…
ABB has launched Infinitus, a direct-current power portfolio designed for the rising electrical demands of AI data centers. The source-to-rack architecture brings together medium-voltage power, DC conversion, distribution, protection and cooling, with 800V DC architectures positioned as a way to reduce conversion losses and infrastructure footprint as AI rack power moves toward the megawatt range….
Teradyne has introduced Iris 100, a production-ready optical test platform for microLED devices, as manufacturers move the technology from laboratory development toward volume production. The platform is designed to test individual emitters across arrays containing millions of microLEDs, with applications spanning AR displays and optical interconnects being developed for AI data centers. The race to…
Lumentum, Qualcomm Technologies and Corning are demonstrating a high-density optical die-to-die interconnect architecture designed for next-generation AI scale-up systems. The ECOC 2026 showcase combines Qualcomm’s D2D interface technology with Lumentum’s 1060nm VCSEL optical engine and Corning’s multimode fiber connectivity, targeting bandwidth-dense links that extend beyond the practical reach of electrical interconnects. AI accelerators are becoming…
Marvell Technology is demonstrating a new generation of 2nm optical interconnect technologies designed to help AI data centers move from 1.6T toward 3.2T networking. At ECOC 2026, the semiconductor company is showcasing 400G-per-lane PAM4, 800G ZR/ZR+ with integrated MACsec, 1.6T coherent links and a 102.4Tbps co-packaged optics platform. The race to scale AI infrastructure is…
Semtech has joined the eXtra-dense Pluggable Optics Multi-Source Agreement (XPO MSA), adding its 200G-per-lane modulator drivers and transimpedance amplifiers to an industry effort focused on higher-density optical interconnects for AI data centers. The move comes as AI clusters push networking toward higher bandwidth, tighter power budgets and denser optical designs. The next bottleneck in AI…
Tencent Cloud and Universiti Teknologi Malaysia (UTM) have formalized a three-year collaboration focused on AI education, cloud skills and industry-led problem solving. The partnership follows a five-week AI hackathon in which UTM students used Tencent’s AI tools to develop solutions for challenges supplied by Malaysian companies. The push to build AI talent is moving beyond…
Huawei has upgraded its Stellar AI WAN Solution to address the networking, cost and security challenges of running AI workloads across geographically distributed infrastructure. Announced at HUAWEI CONNECT 2026, the solution combines lossless networking, distributed inference techniques and multi-layer security to make remote computing resources more accessible to enterprises. As AI workloads spread across regions,…
