Ambarella, Inc. (NASDAQ: AMBA), a leader in edge AI semiconductors, announced the launch of its CV7 edge AI vision SoC at CES 2026, targeting applications across consumer, enterprise, automotive, and industrial markets. The CV7 supports AI-based 8K cameras, multi-imager security systems, robotics (including drones), industrial automation, and video conferencing devices.
Azimuth AI, a California- and Hyderabad-based semiconductor innovator, has closed a new funding round led by Jetha Global, with participation from Moneta Ventures, AUM Ventures, and other investors. The fresh capital comes as the company prepares for large-scale deployment of its ARKA-GKT1 edge-AI System-on-Chip (SoC), designed for smart utilities, industrial infrastructure, and energy-efficient edge intelligence.
STRADVISION, a global leader in AI-based vision perception for autonomous vehicles, joined forces with AMD at CES 2026 to demonstrate its SVNet MultiVision software running on the AMD Versal™ AI Edge Series Gen 2 platform. The showcase used AMD’s VEK385 Evaluation Kit as a technical reference environment, highlighting real-time, multi-camera perception for next-generation ADAS and automated driving applications.
Luxonis has unveiled its OAK 4 devices, a next-generation edge AI camera system that brings 52 TOPS of on-device inference—a 40x increase over the previous generation. Designed for robotics, industrial automation, smart cities, retail, logistics, and advanced driver-assistance systems (ADAS), OAK 4 enables machines to perceive the world without relying on external cloud compute.
Tiiny AI Inc., a US deep-tech startup, has officially unveiled the Tiiny AI Pocket Lab, now verified by Guinness World Records as the “World’s Smallest MiniPC (100B LLM Locally).” The device, roughly the size of a small paperback, packs enough firepower to run a 120-billion-parameter large language model entirely on-device, no cloud, servers, or high-end GPUs required.
Connectivity and embedded computing leader Ezurio has unveiled the Nitrogen95 Connected System-on-Module (SOM), a high-performance platform designed for vision, display, and AI-enabled edge applications. Built on the NXP i.MX 95 applications processor family, the module integrates advanced imaging, AI acceleration, and pre-certified Wi-Fi 6 + Bluetooth LE connectivity.
As AI workloads move from the cloud to devices at the edge, storage has become a critical bottleneck. From AI PCs and intelligent vehicles to robotics, real-time multimodal data, extreme I/O demands, and environmental reliability pose unprecedented challenges for traditional storage solutions.
Merck KGaA, Darmstadt, Germany is turning up the compute dial—hard. The science and technology giant has deployed a new high-performance computing (HPC) platform built on Lenovo ThinkSystem servers with advanced liquid cooling, hosted inside an Equinix AI-ready data center in Germany. For a company with deep stakes in life science, healthcare, and semiconductor materials, compute is no longer background infrastructure—it’s the fuel powering its next decade of scientific discovery.
Saudi Arabia’s ambition to become a global AI heavyweight just notched a major milestone. AMD, Cisco, and HUMAIN—the Public Investment Fund–backed full-stack AI company—announced plans to form a joint venture focused on building world-class AI data center infrastructure at massive scale. And not the theoretical kind. The partners are aiming for up to 1 gigawatt of AI compute capacity by 2030, making the Kingdom one of the largest AI infrastructure hubs outside the US and China.
