Lintes Technology Unveils Modular Near‑Packaged AI Server Interconnect, Merging Copper and Optics
Lintes Technology (TWSE: 6715), a specialist in high‑bandwidth connectivity, announced a new modular interconnect solution aimed at next‑generation AI servers. The offering combines Near‑Packaged Copper (NPC) and Near‑Packaged Optics (NPO) into a single, patented socket architecture, allowing data‑center operators to select between electrical and optical links on a per‑socket basis. The design departs from traditional fixed‑interface…
