Mobile World Congress 2025, MediaTek is showcasing next-generation wireless technologies, including 6G-enabling hybrid computing, a live LEO broadband trial, Sub-Band Full Duplex, and the M90 5G Advanced modem. The company is also highlighting its latest Dimensity Auto and Dimensity Smartphone SoCs, reinforcing its leadership in AI-driven connectivity and semiconductor solutions.
Innovations Announced at MWC 2025
1. 6G Evolution: Hybrid Computing & Edge Cloud Integration
- MediaTek’s Hybrid Computing (Integrated Communication & Computing) merges device-cloud + RAN as an ‘edge cloud’, extending ambient computing from devices to networks.
- This innovation enhances low-latency Generative AI (Gen-AI), carrier-grade data privacy, and dynamic computing resource scheduling.
- Collaborations with NVIDIA, Intel, and G REIGNS drive these advancements.
2. Enhanced Power Efficiency with Envelope Assisted RFFE
- A 25% boost in power amplifier efficiency, reducing heat generation.
- Supports 100MHz+ bandwidth expansion within the same power envelope.
- Delivers higher power output for broader coverage, crucial for next-gen wireless devices.
3. Sub-Band Full Duplex for Optimized 6G Spectrum Usage
- Improves unpaired TDD spectrum utilization, boosting uplink coverage and reducing latency.
- Demonstrates self-interference mitigation in collaboration with Keysight, addressing challenges in compact devices like smartphones.
4. MediaTek M90 5G Advanced Modem: High-Speed & AI-Powered Connectivity
- 12Gbps speeds with support for 3GPP Release 17 & 18 standards.
- FR1+FR2 simultaneous connectivity for enhanced network efficiency.
- Smart AI Antenna technology dynamically adapts to network conditions, improving data throughput.
- UltraSave tech lowers power consumption by 18% compared to previous modems.
5. Smart AI Antenna: Adaptive Connectivity for Better Signal Quality
- AI-driven body proximity sensing without external sensors.
- Adapts antenna and uplink power based on device handling and network conditions.
- Developed in collaboration with Anritsu to enhance signal stability.
6. Intelligent CPE & Generative AI Gateway for Next-Gen Networking
- Expands Generative AI capabilities beyond smartphones to connected IoT devices.
- Enhances privacy, security, and AI-driven automation.
- 1.9x uplink performance boost using 3TX transmission antennas.
- L4S (Low-Latency, Low-Loss, Scalable Throughput) cuts network latency by 20x, reducing packet loss.
7. Next-Gen Satellite Connectivity with NR-NTN
- Showcasing Ku-band NR-NTN technology for ubiquitous 5G satellite broadband.
- Successful field trial with OneWeb, Eutelsat, AIRBUS, and Sharp demonstrates industry leadership.
8. MediaTek Dimensity Auto: AI & Multimedia for Automotive Innovation
- Features hypervisor-based AI processing, advanced 3D graphics, and multimedia capabilities.
- 8K eCockpit display developed with strategic partners for next-gen in-vehicle experiences.
9. Dimensity 9400: AI-Powered Smartphones & Advanced Imaging
- Showcases flagship 5G performance with AI-enhanced applications.
- Advanced AI-driven photography & videography, including AI Audio Focus, AI Telephoto, and AI Depth Engine.
- Ray-traced graphics for next-gen mobile gaming.
10. 224G SerDes for AI, Hyperscale Computing & Data Centers
- Silicon-proven 224G SerDes technology enhances AI acceleration and high-speed interconnect applications.
- Optimized for ASIC, AI infrastructure, and hyperscale data centers.
MediaTek’s MWC 2025 showcase underscores its leadership in 6G, AI-powered connectivity, and next-gen computing. The company’s innovations in hybrid computing, smart AI antennas, 5G-Advanced modems, and Dimensity technology are set to transform mobile networks, AI, and edge computing. As the wireless industry moves towards 6G and AI-driven infrastructure, MediaTek remains at the forefront, driving the next era of connectivity and digital transformation.
