INTSIG is positioning document intelligence as a foundational layer for enterprise AI adoption in Southeast Asia, showcasing its TextIn platform at Cloud & AI Infrastructure Asia 2026 in Singapore. The platform’s xParse and DocFlow technologies are designed to turn complex documents into structured, AI-ready data and automate document-heavy business processes. As enterprises move AI projects…
Stibo Systems is adding agentic AI directly to its master data management platform with AgentWorkx, a framework designed to help enterprises build, deploy and govern AI agents against trusted business data. The company is also introducing two ready-to-use agents aimed at automating data onboarding and product content workflows. Enterprise AI agents are moving beyond chat…
HighLevel has connected its business operating platform to Meta’s Muse AI agent, allowing businesses to use agentic AI across customer information, conversations, calendars and workflows while keeping HighLevel as the operational layer. HighLevel Turns Meta Muse Into a Business Workflow Layer HighLevel is extending its AI infrastructure beyond its own native tools by connecting its…
Sumsub has launched the Sumsub Agentic AI Council, an APAC-focused forum intended to bring policymakers, academics, technology companies, industry groups and civil society together around the practical governance of AI agents. The initiative will focus on agent identity, delegated authority, security, transparency, accountability and oversight as autonomous AI systems move into commercial workflows. The shift…
The AI industry’s next challenge may be less about building compute capacity than generating enough economic value to support it. Bain & Company’s seventh annual Global Technology Report estimates that AI would need to generate about $6 trillion in annual revenue by 2031 to justify the infrastructure investment now underway, with existing consumer and enterprise…
MagPro has introduced AeroLev 1850, a 1.85 MW-class air-cooled magnetic-bearing chiller designed for AI data centers operating in hot, water-constrained environments. The platform combines oil-free magnetic-levitation compression, air cooling and intelligent controls, while supporting chilled-water temperatures of up to 45°C for emerging high-temperature liquid-cooling architectures. AI data centers are creating a cooling problem that is…
SUNON is taking a chip-to-rack approach to liquid cooling as AI workloads push data center power density higher. At the 2026 OCP Global Summit, the thermal-management company will showcase cooling technologies spanning chip, server and rack levels, positioning integrated thermal infrastructure as an increasingly important part of AI data center design. AI infrastructure is running…
Yokogawa Engineering Asia has joined the Sustainable Tropical Data Centre Testbed Phase 2.0 (STDCT 2.0) Consortium at the National University of Singapore, bringing industrial automation, measurement and autonomous operations expertise to efforts focused on more efficient AI data centers. The collaboration comes as rising AI workloads increase pressure on power, cooling, reliability and operational resources,…
SEMIFIVE has signed a KRW 70.3 billion ($52 million) contract with a U.S.-based AI fabless company to develop a next-generation AI inference accelerator, marking the Korean semiconductor company’s first North American “Spec Hand-off” engagement. The project comes as hyperscalers and cloud providers increasingly turn to custom silicon to optimize AI inference performance, power consumption and…
