Rebellions Taps CoAsia SEMI to Power Next-Gen AI Chiplets with Advanced Packaging
Korean AI semiconductor unicorn Rebellions is doubling down on chiplet architecture in a strategic pact with CoAsia SEMI, the system semiconductor design specialist behind some of the industry’s most advanced packaging tech. The two companies are teaming up to develop REBEL-based chiplet and software solutions aimed squarely at the data center and high-performance computing (HPC) sectors.
Announced on July 22 at Rebellions’ Seoul HQ, the deal formalizes a deepening partnership that builds on their April collaboration on a multi-petaflops PIM server chiplet project. But this time, it’s not just about R&D—this is about scaling, commercialization, and competing globally.
The REBEL Alliance: Why This Matters
At the core of this alliance is REBEL, Rebellions’ next-generation AI chiplet architecture. While chiplets aren’t new, they’re quickly becoming the go-to solution for AI and HPC workloads—offering scalability, improved yields, and power-performance optimization that monolithic SoCs simply can’t match.
The joint effort will leverage CoAsia SEMI’s advanced 2.5D silicon interposer and packaging technologies, along with its manufacturing know-how. Rebellions, for its part, will focus on expanding the REBEL architecture to include heterogeneous chiplets, I/O dies, and HBM3E—crucial elements for high-throughput AI tasks.
It’s a full-stack collaboration, too. With global OSAT and IP vendors also in the mix, the companies are building a complete AI semiconductor value chain—from fabless design to packaging and testing. It’s an ambitious play, but one that puts them in direct contention with major chiplet proponents like AMD, Intel, and Tenstorrent.
Market Impact and Global Ambitions
Development and verification of the new REBEL chiplets are expected to wrap by late 2026, with plans for mass production targeting domestic and global data center clients soon after. CoAsia SEMI even hinted at a deal with a Tier-1 U.S.-based AI customer, a clear signal that they’re aiming far beyond the Korean market.
This move also aligns with broader semiconductor trends—particularly the shift away from monolithic chip designs toward modular, scalable chiplet-based systems that better support complex AI workloads. As NVIDIA and Intel face growing pressure to deliver more power-efficient and scalable silicon, challengers like Rebellions are seizing the opportunity to redefine the landscape.
What’s Next for REBEL?
The REBEL roadmap just got longer. By integrating advanced packaging and I/O scalability into its design DNA, Rebellions is evolving from an AI inference chipmaker into a serious player in the data center and HPC space. Expect its product portfolio to stretch beyond edge AI and into the heart of hyperscale infrastructure.
“This collaboration is part of our broader strategy to diversify and strengthen our AI semiconductor offerings,” said Rebellions CEO Sung Hyun Park. “Through our partnership with CoAsia SEMI, we’re building a next-gen packaging ecosystem ready for scale.”
For CoAsia SEMI, this partnership is a chance to showcase its technical muscle in an AI arena increasingly defined by ecosystem depth and integration. “We’re bringing together design, packaging, and software to help shape the future of AI semiconductors,” said CEO DS Shin. “And we’re just getting started.”
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