Mixx Technologies, Inc., a leader in next-generation optical interconnect solutions, has launched its Advanced 3DS Platform, a groundbreaking AI and HPC connectivity fabric that redefines compute, memory, and networking integration. This ultra-efficient solution addresses critical AI infrastructure bottlenecks, ensuring seamless scalability and real-time performance. The platform will be showcased at the OFC 2025 Conference (April 1-3, 2025) at the Moscone Center in San Francisco, where Mixx Technologies will exhibit at both the Corning booth (#1643) and the US Conec booth (#1443).
The Need for Next-Gen AI Interconnects
- Rising AI Infrastructure Demands
- Gartner projects global data center spending will reach $405 billion in 2025, driven by AI investment.
- Dell’Oro Group forecasts $1 trillion+ data center spending by 2029, highlighting the need for scalable solutions.
- Interconnect Bottlenecks in AI Workloads
- Traditional networking struggles to keep pace with AI’s massive data movement needs.
- Mixx Technologies integrates silicon photonics with optical interconnects, delivering non-blocking, energy-efficient data movement.
Features of Mixx Technologies’ Advanced 3DS Platform
- Mixx’d Intelligence
- Dynamic orchestration with flexible resource allocation for real-time compute scaling.
- Unmatched Speed & Scalability
- Multi-petabit optical interfaces provide low-latency, high-throughput AI training and real-time inference.
- Reliability-First Design
- Silicon-integrated optical interconnects reduce network complexity and enhance uptime for AI workloads.
- Future-Proof Infrastructure
- Standards-compliant architecture ensures seamless upgrades and long-term AI scalability.
Industry Vision & Expert Endorsements
Vivek Raghuraman, Co-Founder & CEO, Mixx Technologies, emphasized the need for cost-effective AI scaling:
“Our goal is not just to build another product, but to fundamentally rethink AI interconnects. The Advanced 3DS Platform unlocks unprecedented performance, ensuring that AI workloads scale beyond today’s architectural limitations.”
OFC 2025: Mixx Technologies CEO to Present on AI Interconnects
In addition to showcasing its Advanced 3DS Platform, Mixx Technologies CEO Vivek Raghuraman will present a session titled:
“The Paradigm Shift: Bringing Optics to AI”
April 2, 2025 | 2:00 PM PT
OFC 2025 | Rooms 201 & 202 – Level 2
This session will discuss:
- The need for high-density AI interconnects
- Why current packaging architectures are unsustainable
- How silicon photonics enables scalable, long-term AI infrastructure
As AI workloads surge, Mixx Technologies’ Advanced 3DS Platform is set to transform AI and HPC infrastructure with its high-speed, energy-efficient, and scalable connectivity. With strong industry partnerships and deep semiconductor expertise, Mixx Technologies is paving the way for next-generation AI interconnect solutions.
