Intel has unveiled the architectural details for its next-generation client and server processors, the Intel Core Ultra series 3 (Panther Lake) and Xeon 6+ (Clearwater Forest), both built on its cutting-edge Intel 18A process. Panther Lake is expected to begin shipping later this year, while Xeon 6+ is slated for early 2026. Both are manufactured at Intel’s Fab 52 in Chandler, Arizona, marking a milestone in domestic semiconductor production.
“We are entering an exciting new era of computing, made possible by great leaps forward in semiconductor technology,” said Intel CEO Lip-Bu Tan. “Our next-gen compute platforms, combined with leading-edge process technology and advanced packaging, are catalysts for innovation across our business as we build a new Intel.”
Panther Lake: AI-Powered PCs and Edge Devices
Intel Core Ultra series 3 processors, codenamed Panther Lake, are the first client SoCs built on Intel 18A. Designed for AI PCs, gaming systems, and edge applications, Panther Lake features a scalable multi-chiplet architecture that balances performance, efficiency, and AI acceleration.
Key highlights include:
- Up to 16 performance and efficient cores delivering 50% faster CPU performance versus previous generations.
- Intel Arc GPU with up to 12 Xe cores for 50% faster graphics performance.
- Balanced XPU design offering up to 180 Platform TOPS for AI workloads.
- Support for robotics and edge AI with the new Intel Robotics AI software suite.
High-volume production ramps this year, with first shipments scheduled before year-end and broad availability in January 2026.
Clearwater Forest: Efficient, Scalable Servers
The Xeon 6+ processor, code-named Clearwater Forest, is Intel’s most efficient server CPU yet. Built on 18A, it offers up to 288 E-cores and a 17% IPC uplift over prior generations. Targeted at hyperscale data centers, cloud providers, and telcos, Clearwater Forest aims to scale workloads, reduce energy costs, and power intelligent services efficiently.
Intel 18A: U.S.-Made Semiconductor Innovation
Intel 18A, Intel’s first 2-nanometer-class node developed and manufactured in the U.S., delivers up to 15% better performance per watt and 30% improved chip density over Intel 3. Innovations include RibbonFET transistor architecture for improved efficiency and PowerVia backside power delivery for enhanced signal and energy flow. Advanced packaging with Foveros enables multi-chiplet integration, powering flexible and high-performance SoCs.
Fab 52: Expanding U.S. Manufacturing Leadership
Fab 52 at Intel’s Ocotillo campus in Arizona produces Intel 18A chips, supporting domestic semiconductor leadership. Combined with R&D in Oregon and packaging in New Mexico, Intel is investing $100 billion to expand U.S. manufacturing and strengthen the domestic semiconductor supply chain.
Panther Lake and Clearwater Forest, along with future 18A products, position Intel to lead in AI-enabled PCs, edge devices, and high-efficiency data centers—demonstrating the company’s commitment to innovation and U.S. technology sovereignty.
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