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Digital Transformation
Credo Technology Joins Arm Total Design to Accelerate AI and Data Center Innovation
Credo Technology Group Holding Ltd (NASDAQ: CRDO), a provider of high-speed connectivity solutions, has joined the Arm® Total Design ecosystem, expanding the ecosystem’s capabilities in next-generation AI, cloud, and hyperscale data center applications. By contributing its high-speed SerDes and mixed-signal DSP IP portfolio, including chiplets, Credo enables partners to rapidly develop custom silicon optimized for performance, energy efficiency, and reliability. Read More
VIA NEXT Joins Arm Total Design Ecosystem to Accelerate AI and HPC Innovation
VIA NEXT, a leading provider of system-level design services, has joined the Arm® Total Design ecosystem, signaling a commitment to accelerate AI and high-performance computing (HPC) innovation. The collaboration leverages VIA NEXT’s expertise in system integration, chiplet architectures, and advanced packaging to deliver end-to-end solutions from SoC architecture to system-level testing. Read More
PlusAI’s SuperDrive™ Named One of Fast Company’s 2025 Next Big Things in Tech
PlusAI, a Physical AI company developing AI-based virtual driver software for autonomous trucks, has been named to Fast Company’s 2025 Next Big Things in Tech list in the Transportation category. The recognition spotlights emerging technologies with the potential to reshape industries and society. Read More
Scality Expands AI Ecosystem Certification to Cover 20+ Tools and Frameworks
Scality, a global leader in cyber-resilient storage software for the AI era, has broadened its AI ecosystem certification program, now covering over 20 of the industry’s most critical AI and machine learning tools and frameworks. The initiative aims to ensure interoperability, data integrity, and security across the full AI lifecycle, giving enterprises and startups a trusted blueprint for faster, more reliable AI deployments. Read More
Accelsius Launches NeuCool MR250 for Scalable AI and HPC Liquid Cooling
Accelsius, a pioneer in two-phase, direct-to-chip (2P D2C) liquid cooling, has announced the general availability of NeuCool® MR250, its first row-based Coolant Distribution Unit (CDU) designed to scale high-performance cooling for AI and HPC data centers. The MR250 will make its public debut at the Open Compute Project (OCP) Global Summit, October 13–16, in San Jose. Read More
Oracle Launches Intelligent Communications Orchestration Cloud to Simplify Enterprise Networks
Oracle has introduced the Oracle Intelligent Communications Orchestration Network Cloud Service, a next-generation platform designed to simplify complex enterprise communication networks. The solution centralizes and orchestrates voice, collaboration, AI, and other services across on-premises, cloud, or hybrid environments—helping enterprises and managed service providers reduce operational overhead while improving agility. Read More
TestGorilla Launches AI Video Interviews to Replace Manual Screening Calls
Recruitment just got a high-tech upgrade. TestGorilla, known for its skill-focused talent discovery platform, has unveiled AI-driven video interviews designed to replace traditional manual screening calls. The new feature, available in both one-way and conversational formats, evaluates candidates’ skills and behaviors, offering instant, science-backed scores that help recruiters shortlist faster—and more confidently. Read More
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